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|Semiconductor Industry Leaders Form DA5 Consortium to Explore Lead-Free Solutions|
Seeking a Common Lead-Free High Melting Temperature Die Attach Material
REUTLINGEN, GERMANY – April 21, 2010 – Bosch (Division Automotive Electronics), Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics today announced that they have formed a consortium to jointly investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing. The five company consortium is known as the DA5 (Die Attach 5).
Implementation and availability
For environmental reasons, the semiconductor industry is making every effort to eliminate high-lead solder, where feasible. However, there is no single identified lead-free solution for all applications and there is no expectation of a substitute for a high-lead solder die attach before 2014. Any solution will require substitute material development and evaluation, internal semiconductor process and product qualification, and semiconductor production conversion to guarantee product reliability.
By jointly developing and qualifying an alternative, the DA5 consortium aims to reduce the qualification time needed by its customers and provide lead-free and environmentally friendly solutions as quickly as possible.
The consortium approach
A previous joint effort known as the E4* successfully implemented more environmentally friendly materials for semiconductor packages. Lead-free high melting temperature die attach was not in the scope of the E4 effort since this solder material was exempted from the 2006 EU RoHS Directive.
The announced DA5 consortium aims to reinitiate the earlier E4 cooperation and use the proven formula for success to lead the industry into the next phase of the lead-free semiconductor evolution. In this way the DA5 companies are also actively supporting the demands of the European Union towards reduced lead in electronics.
Lead in semiconductor products
Semiconductor products use high-lead containing solder for a die attach material in power devices, in diodes and transistors, for clip bonding of discrete devices and for surface mount and insertion components. Many of these devices have an essential safety purpose in automotive applications. The unique properties, such as the high melting point and thermal conductivity of these high-lead alloys, are necessary for the level of reliability required for these products.
Currently, there is no proven alternative for these high-lead die attach solders. Therefore, the DA5 consortium companies are soliciting input from die attach material suppliers to jointly evaluate and develop possible alternatives. This approach is expected to speed implementation and customer acceptance of the environmentally friendly materials.
Press contact information:
Freescale Semiconductor: Andy.North@Freescale.com
Infineon Technologies: email@example.com
NXP Semiconductors: firstname.lastname@example.org
About Robert Bosch GmbH (Division Automotive Electronics)
The Bosch Group is a leading global supplier of technology and services. According to preliminary figures, some 270,000 associates generated sales of roughly 38 billion euros in the areas of automotive and industrial technology, consumer goods, and building technology in fiscal 2009. The Bosch Group comprises Robert Bosch GmbH and its more than 300 subsidiaries and regional companies in over 60 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. This worldwide development, manufacturing, and sales network is the foundation for further growth. Each year, Bosch spends more than 3.5 billion euros for research and development, and applies for over 3,000 patents worldwide. With all its products and services, Bosch enhances the quality of life by providing solutions which are both innovative and beneficial. Within the Bosch-Group, the Automotive Electronics Division with its headquarters located in
About Freescale Semiconductor
Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial and networking markets. The privately held company is based in
About Infineon Technologies
Infineon Technologies AG,
About NXP Semiconductors
NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2009, the Company’s net revenues were $8.51 billion. Further information on ST can be found at www.st.com.
* In 2001, Infineon Technologies, NXP Semiconductors and STMicroelectronics announced their initiative to standardize a roadmap to lead-free semiconductor terminations and packages capable of withstanding lead-free solder temperatures. Freescale Semiconductor joined this initiative in 2004. These semiconductor companies, together known as E4, removed the majority of lead from the terminals of the parts.